Overview of Multi-Die Design in Automotive Applications
Key Topics
- Category: Auto, Security & Edge AI
- Focus: Multi-die designs in automotive electronics, particularly for Advanced Driver Assistance Systems (ADAS) and In-Vehicle Infotainment (IVI) systems.
Highlights from the Whitepaper
-
Reliability and Safety: Multi-die design is crucial for meeting the high standards of reliability and safety required in automotive applications. As user expectations and regulatory demands increase, functional safety becomes a priority in chip development.
-
Trends in Semiconductor Industry:
- Functional Safety: Adhering to standards and user demands influences technology choices and implementations in chip design.
- Multi-Die Designs: Integrating homogeneous and heterogeneous dies in a single package provides flexibility and efficiency. Factors like yield, die combinations, and optimizing power, performance, and area (PPA) contribute to the growing popularity of this design approach.
Conclusion
This white paper delves into the intersection of functional safety and multi-die design, outlining its advantages and the challenges it presents for automotive applications.
For further insights, read more here.
