Hangsheng Electronics and NXP Semiconductors recently inaugurated their joint technology innovation lab in Shenzhen, marking a key transition in their long-term partnership towards tangible project execution. Their collaboration, which spans over 30 years, aims to strengthen system-level cooperation as detailed in their recent MoU 2.0 agreement.
The lab will address three main areas of focus: smart cockpits, software-defined vehicles, and AI innovation applications. In smart cockpits, they plan to utilize NXP’s i.MX 9 platform for comprehensive system solutions. For software-defined vehicles, they will engage in joint R&D and design efforts centered around NXP’s CoreRide platform and S32K5 automotive microcontrollers.
Additionally, the partnership will emphasize the development of innovative platforms in AI edge computing, exploring on-device AI and other integrations to enhance the relationship between automotive technology and AI.
