Categories Automotive

Vishay Intertechnology Unveils Low Profile Common Mode Chokes for Commercial and Automotive Use, Featuring Superior Shock and Vibration Resistance

Vishay Intertechnology Introduces Low Profile Common Mode Chokes

Date: September 1, 2026
Location: Malvern, PA

Vishay Intertechnology, Inc. (NYSE: VSH) has announced two new low profile common mode chokes, designed for high current automotive, energy, and industrial applications. The devices, the ICMS2321-10 in surface-mount and ICMS2321-1A in automotive grade, feature a heat rating current of up to 30 A and can withstand operating temperatures up to +150 °C.

Key Features:

  • Design & Construction: Low profile, self-shielded, and rugged construction enhances performance against shock and vibration.
  • Applications: Suitable for DC/DC converters, high voltage inverters, EMI filters, and high current filters for noise suppression in various circuits, including automotive on-board chargers.
  • Customization Options: Offers customizable inductance, impedance, DCR, and current ratings.
  • Mounting Options: Available in both SMD and through-hole packages, with surface-mount devices compatible with automated assembly methods.
  • Environmental Compliance: RoHS-compliant and halogen-free, aligned with Vishay’s commitment to sustainability.

Device Specifications:

Feature ICMS2321-10 ICMS2321-1A
Inductance 70 µH to 480 µH 70 µH to 480 µH
DCR Typ 1.2 mΩ to 13.4 mΩ 1.2 mΩ to 13.4 mΩ
Heat Rating Current Typ (1) 7 A to 20 A 10 A to 30 A
Common Mode Impedance (1 MHz) 540 Ω to 3790 Ω 540 Ω to 3790 Ω
AEC-Q200 Qualified No Yes

(1) DC current that will cause an approximate ΔT of specified value in Celsius.

Availability:

Samples and production quantities are currently available with a lead time of 12 weeks.

For more information, please visit Vishay’s official site.


Contact Information:

  • Peter Henrici
    Vishay Intertechnology
    +1 408 567-8400
    Email

  • Bob Decker
    Redpines
    +1 415 409-0233
    Email

Social Media:

Product Links:

For further details, please see the links provided or contact the individuals listed above.

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