At the 2026 Yunqi Conference, XPENG and Banma announced a joint automotive-grade AI cockpit solution. This solution utilizes an on-device large model and supports local deployment of 30B-class models, powered by XPENG’s Turing AI chip, which offers 750 TOPS of effective computing power. Key features include:
- Core Capabilities: The solution enables multi-turn conversations, multimodal interactions, and offline Q&A.
- Architecture: It follows an “on-device first, cloud-assisted” model, enhancing reliability by minimizing dependence on cloud connectivity for core AI functions.
- Technical Features: Supports real-time inference, complex task planning, and proactive, scenario-based services without needing continuous internet access.
- Strategic Goals: Aims to combine high-computing chips with in-vehicle OS ecosystems, targeting mid- and high-end vehicles. Banma has secured partnerships with over 60% of automakers for in-vehicle deployments.
This innovative approach is designed for enhanced user experience in smart vehicles while addressing connectivity challenges in various markets.
