Himax Technologies, Inc. (Nasdaq: HIMX) has announced its participation in the upcoming SID Vehicle Displays and Interfaces Symposium, taking place on September 15-16, 2026, in Detroit, Michigan. The company will showcase its automotive display portfolio and advanced 3D sensing technologies.
With the evolution of smart vehicle interiors, displays are becoming central to design, leading to a wide array of sizes and configurations. Himax claims to have the industry’s most comprehensive automotive display IC portfolio, including LCD and OLED technologies.
At the event, Himax will present several innovations, including:
- Automotive TDDI with High-Speed eDP Interface: A single-chip solution integrating touch and display driver functionality for high-quality automotive displays.
- Single-Chip Design with Local Dimming: Designed for smaller displays to enhance contrast and efficiency.
- OLED Touch IC and LCD TDDI: Features user-aware touch controls to minimize driver distraction.
- Groundbreaking Multi-Output Tcon: Supports high-definition displays and incorporates automotive safety functions.
Beyond display technologies, Himax will demonstrate 3D sensing innovations, such as:
- Glasses-Free 3D Total Solution: Converts stereo input to real-time glasses-free 3D output.
- SLiM™ 3D Sensing Module: Offers head orientation tracking for intuitive HMI systems.
- 3D Eye and Hand Tracking: Provides real-time tracking for seamless user interaction.
- Micro- and Nano-Pattern Design Services: Delivered through Himax IGI Precision Ltd for tailored 3D structures.
Attendees are encouraged to visit Himax’s booth at the symposium for first-hand experience of their technologies. The company, based in Tainan, Taiwan, is a leader in semiconductor solutions, particularly in automotive display technology.