American Institute in Taiwan (AIT) Director Raymond Greene praised Taiwan Semiconductor Manufacturing Co. (TSMC) for its US$100 billion investment plan in the U.S., viewing it as a positive signal for U.S.-Taiwan relations. Greene explained that this expansion allows TSMC to better serve American clients and adapt quickly to rising global demand for advanced chips.
Despite worries that such overseas investments might weaken Taiwan’s semiconductor leadership and its strategic position against threats from China, Greene emphasized that Taiwan would continue to be central to the semiconductor industry. TSMC’s projected growth from approximately NT$4.3 trillion (US$133 billion) in 2023 to NT$8.4 trillion in 2026 supports this stance.
TSMC’s Chairman, C.C. Wei, announced the investment during their quarterly earnings meeting, pushing TSMC’s total commitment in Arizona to US$265 billion, which includes four new advanced manufacturing facilities in the U.S. The U.S. Department of Commerce highlighted that this move would generate tens of thousands of jobs and bolster domestic semiconductor production.
Wei noted the new investment would support advanced wafer and packaging facilities to meet demand from U.S. customers but did not specify a timeline, as progress depends on market conditions. Prior to this announcement, TSMC had already pledged US$165 billion for multiple facilities in Arizona. The first fab is operational, with others scheduled for future production.